Shuttle XPC slim DB860 Leverages Core Ultra 200 in Compact 1.3L Barebone
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Shuttle has revealed the XPC slim DB860, a compact 1.35-liter barebone system built around Intel Core Ultra 200 series processors. The system provides desktop-class performance in a compact metal chassis and supports continuous operation. The platform supports Intel Core Ultra 200 processors (Arrow Lake-S) using the LGA1851 socket, with a maximum TDP of 65 W. […]
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