Hot chips on parade at MWC and Embedded World

Posted by bob on Mar 4, 2018 2:24 AM EDT; By Eric Brown
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Intel debuted a Stratix 10 TX FPGA with 58Gbps transceivers while the industry kicked the tires of major new SoCs like the AMD Ryzen Embedded V1000 and Qualcomm Snapdragon 845 and anticipated Arm’s Project Trillium AI chips and Intel’s 10nm Cannon Lake and Ice Lake.

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» Read more about: Story Type: Editorial, Roundups; Groups: ARM, Developer, Embedded, Intel, Mobile

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